自动驾驶摄像头
摄像头转接板
针对客户采用nVidia Jetson Xavier EV kit或采用nVidia Jetson Xavier、Jetson NX之SOM，并搭配使用nVidia指定之B2B Connector“Samtec QTH-060-07-H-D-A”设计之载板(Carrier Board)时，可利用欧特明的oToDAS 700T interposer board接取多颗LVDS界面的车规级摄像头，并将收取到的video，以反串行化方式(deserializer) 转换为MIPI CSI-2的格式后，实时同步地将数据送至EV kit与平台端。
| Items | Spec. | Note |
|---|---|---|
| Voltage (Typical) | 12V |
|
| Inputs |
Up to 8 x FPD-Link III Coax |
Refer to Table 1 |
| Deserializer | TI FPD-Link III, DS90UB960 | 2 pieces |
| Coax Input Connectors | Amphenol FK1252ZW-030-TLCP5G-50,Code Z, R/A, Coaxial connector | 8 pieces |
| B to B Connector | Samtec QTH-060-07-H-D-A | |
| Power Connector | Hirose DF51A-5P-2DSA | |
| Dimension (X/Y/Z) | 91mm*87.8mm*1.6mm | Exclude the height of components |
| Operating Temperature | -40 to +85℃ | |
| Storage Temperature | -40 to +95℃ |
Product Document
| Type | Product | |
|---|---|---|
| Brochure | oToDAS 700T | 下載 |