针对客户采用nVidia Jetson Xavier EV kit或采用nVidia Jetson Xavier、Jetson NX之SOM,并搭配使用nVidia指定之B2B Connector“Samtec QTH-060-07-H-D-A”设计之载板(Carrier Board)时,可利用欧特明的oToDAS 700T interposer board接取多颗LVDS界面的车规级摄像头,并将收取到的video,以反串行化方式(deserializer) 转换为MIPI CSI-2的格式后,实时同步地将数据送至EV kit与平台端。

Items Spec. Note
Voltage (Typical) 12V

 

Inputs

Up to 8 x FPD-Link III Coax

Refer to Table 1

Deserializer TI FPD-Link III, DS90UB960 2 pieces
Coax Input Connectors Amphenol FK1252ZW-030-TLCP5G-50,Code Z, R/A, Coaxial connector 8 pieces
B to B Connector Samtec QTH-060-07-H-D-A  
Power Connector Hirose DF51A-5P-2DSA  
Dimension (X/Y/Z) 91mm*87.8mm*1.6mm Exclude the height of components
Operating Temperature -40 to +85℃  
Storage Temperature -40 to +95℃  

Product Document

Type Product PDF
Brochure oToDAS 700T 下載

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